Relife RL-088 Universal Magnetic Base for Mobile Phone BGA Soldering

Relife RL-088 Tin-planted Universal Magnetic Base for Mobile Phone BGA Soldering Repair

Features:

• RL-088 tin-planted universal magnetic fixture, say goodbye to paper towel planting tin, which can be used for chip positioning and adhesive removal, and strong magnetic adsorption for tin planting
• It has the characteristics of anti-static, strong magnetic adsorption, high-temperature resistance, steel plate weight gain, chemical corrosion resistance, etc
• Multifunctional double-sided double-use, it is suitable for repairing motherboards of different shapes, general tin planting of various BGA chips, etc
• Front side – suitable for all kinds of BGA chips; Reverse side – suitable for different shapes of motherboards
• Various types of tin-planting stencils are commonly used, which can effectively avoid the phenomenon of tinning on the bottom of the stencil due to heating and swelling
• Multifunctional position adjustment, decompression protection, tin planting automatically balances the stencil and decompress it, effectively protecting the chip and making it safer
• New silicone material, high-temperature resistance without bulging, flame retardant, corrosion resistance
• Insulating material, with good anti-collision / anti-skid / anti-acid properties, and wear-resistant and easy to clean
• Embedded high-temperature magnets, strong magnetic adsorption, precise positioning, no offset, high-temperature magnetism unchanged
• High hardness weight-added steel, strong anti-deformation ability, high-quality carbon steel material, not afraid of corrosion