Fonekong Solder Paste 183°

DESCRIPTION:

Temperature: 183℃ FONEKONG

It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.

Feature :

Excellent capacity of solder-stickiness
Excellent Anti-wet Capacity
Widely used on BGA, PGA, CSP packages and flip chip operation
Suitable for multiple PCB reflow
No-clean and Lead free for environmental protection

Additional information

Weight	0.100 kg
Dimensions	5 × 5 × 5 cm

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