Description :
0.15MM Amaoe BGA Stencil FOR EMMC/EMCP/UFS IC Chip Reballing Pins Solder Tin Plant Net Heating Template EMMC:2.
Features :
1. Brand New.
2. BGA stencil for reballing pins, BGA Stencil Car PC Board Controller IC Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh.
Advantage:
1. Deformation resistant material
2. Precise pins location
3. Square round hole
4. Good material
MODEL NUMBERS SUPPORTED :
BGA221
BGA153
BGA169
BGA254
BGA162
BGA186
Package Content*
1x AMAOE BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM
Amaoe EMMC1 BGA Reballing Stencil For EMMC/EMCP/UFS IC Chip 0.15MM
Rs.299.00 Original price was: Rs.299.00.Rs.198.00Current price is: Rs.198.00.
AMAOE EMMC3 Stencil-EMMC3, EMMC/EMCP/UFS/UMCP/LPDDR/PCIE/NAND
Rs.299.00 Original price was: Rs.299.00.Rs.198.00Current price is: Rs.198.00.
-34%
Amaoe EMMC2 BGA Reballing Stencil for EMMC/EMCP/UFS IC CHIP 0.15MM
Rs.299.00 Original price was: Rs.299.00.Rs.198.00Current price is: Rs.198.00.
Amaoe EMMC2 BGA Reballing Stencil for EMMC/EMCP/UFS IC CHIP 0.15MM
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Description
Additional information
Weight | 0.010 kg |
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